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Current issue

ELEKTRO 5/2019 was released on May 15th 2019. Its digital version will be available imediately.

Topic: Lightning and overvoltage protection; Fire and safety technologies

Main Article
Verification of material coefficient defined in the standard STN EN 62305-3
Smart Cities (final part 10)

SVĚTLO (Light) 2/2019 was released on March 15th 2019. Its digital version will be available immediately.

Architectural and scenic lighting
The architectural lighting of Bečov nad Teplou castle
Lighting design in a nutshell – Part 41
The analyse of light picture a little more theoretic

Day light
Biggest mistakes in day lighting design of buildings

Engineers produce smallest 3-D transistor yet

10.12.2018 | MIT | www.mit.edu

Researchers from MIT and the University of Colorado have fabricated a 3-D transistor that’s less than half the size of today’s smallest commercial models. To do so, they developed a novel microfabrication technique that modifies semiconductor material atom by atom.

The inspiration behind the work was to keep up with Moore’s Law, an observation made in the 1960s that the number of transistors on an integrated circuit doubles about every two years. To adhere to this “golden rule” of electronics, researchers are constantly finding ways to cram as many transistors as possible onto microchips. The newest trend is 3-D transistors that stand vertically, like fins, and measure about 7 nanometers across — tens of thousands of times thinner than a human hair. Tens of billions of these transistors can fit on a single microchip, which is about the size of a fingernail.

3D transistors

As described in a paper presented at this week’s IEEE International Electron Devices Meeting, the researchers modified a recently invented chemical-etching technique, called thermal atomic level etching (thermal ALE), to enable precision modification of semiconductor materials at the atomic level. Using that technique, the researchers fabricated 3-D transistors that are as narrow as 2.5 nanometers and more efficient than their commercial counterparts.

Read more at MIT

Image Credit: MIT