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Current issue

ELEKTRO 2/2019 was released on February 13th 2019. Its digital version will be available on March 11th 2019.

Topic: Electrical appliances – switching, protective, signalling and special

Main Article
Advanced power converter topology
Smart Cities (part 7)

SVĚTLO (Light) 1/2019 was released on February 4th 2019. Its digital version will be available on March 5th 2019.

Fairs and exhibitions
Invitation at LIGHT IN ARCHITECTURE exhibition
Prolight + Sound 2019: keep up with time
The light at For Arch 2018 fair

Public lighting
Lights of towns and communities 2018 – the meeting at the round table

Integrating optical components into existing chip designs

20.04.2018 | MIT | news.mit.edu

Two and a half years ago, a team of researchers led by groups at MIT, the University of California at Berkeley, and Boston University announced a milestone: the fabrication of a working microprocessor, built using only existing manufacturing processes, that integrated electronic and optical components on the same chip.

The researchers’ approach, however, required that the chip’s electrical components be built from the same layer of silicon as its optical components. That meant relying on an older chip technology in which the silicon layers for the electronics were thick enough for optics.

Integrating component on existing chips

In the latest issue of Nature, a team of 18 researchers, led by the same MIT, Berkeley, and BU groups, reports another breakthrough: a technique for assembling on-chip optics and electronic separately, which enables the use of more modern transistor technologies. Again, the technique requires only existing manufacturing processes.

Read more at MIT

Image Credit: Amir Atabaki

-jk