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ELEKTRO 3/2020 was released on March 13th 2020. Its digital version will be available immediately.

Topic: Trends in electrical engineering

Main Article
Use of frequency converter for experimentational device

SVĚTLO (Light) 2/2020 was released on March 6th 2020. Its digital version will be available immediately.

Market, business, enterprise
BOOBA in new showroom, which surpassed all expectations
Discourse with Technology of Capital city Prague chairman of management

Day light
Diagram of overshadow for 21st march
Modern methods of gaining dates for processing lighting technology assessment

CEA-Leti Presents High-Performance Processor

21. 2. 2020 | CEA-Leti | www.leti-cea.com

For decades, the trend was for more and more of a computer’s systems to be integrated onto a single chip. Today’s system-on-chips, which power smartphones and servers alike, are the result. But complexity and cost are starting to erode the idea that everything should be on a single slice of silicon.

Already, some of the most of advanced processors, such as AMD’s Zen 2 processor family, are actually a collection of chiplets bound together by high-bandwidth connections within a single package. This week at the IEEE Solid-State Circuits Conference (ISSCC) in San Francisco, French research organization CEA-Leti showed how far this scheme can go, creating a 96-core processor out of six chiplets.

96 core processor

The CEA-Leti chip—for want of a better word—stacks six 16-core chiplets on top of a thin sliver of silicon, called an active interposer. The interposer contains both voltage regulation circuits and a network that links the various parts of the core’s on-chip memories together. Active interposers are the best way forward for chiplet technology if it is ever to allow for disparate technologies and multiple chiplet vendors to be integrated into systems, according to Pascal Vivet, a scientific director at CEA-Leti.

Read more at CEA-Leti

Image Credit: CEA-Leti

-jk-